According to Financial News, Terafab plans to devote about 700,000 wafers a month to memory and more than 300,000 to logic chips. For comparison, Samsung's DRAM capacity was estimated last year at 650,000 to 700,000 wafers a month, and SK hynix's at about 550,000. The comparison is partial: Terafab's figure covers all of its planned memory output, which could include NAND, while the Samsung and SK hynix figures are DRAM only.
Terafab's procurement team visited Japan this month to meet equipment suppliers, and some were asked to deliver within a few months. According to The Elec, company representatives visited the booths of about ten Korean firms at SEMICON West, and some signed NDAs. According to Jiji Press, Terafab is working with Intel to adopt its 2nm and 1.4nm processes, but no technology partner has been named for memory, and it is not clear what type of memory will be made.
The timeline is aggressive: volume production is planned for the second half of 2028, and a first SRAM test chip is expected around May or June 2027 at the Austin research facility. Musk himself said last month that the dates are "very aggressive." The first phase, in Grimes County, Texas, is budgeted at $16.8 billion, and total investment could reach $119 billion if later phases proceed.